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8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO., , , , , , , , , and 16 other author(s). OFC, page 1-3. IEEE, (2021)Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity., , , , , , , , , and 2 other author(s). CICC, page 1-8. IEEE, (2024)Emerging standards at ∼10 Gbps for wireline communications and associated integrated circuit design and validation., and . CICC, page 105-112. IEEE, (2009)In-Package Domain-Specific ASICs for Intel® Stratix® 10 FPGAs: A Case Study of Accelerating Deep Learning Using TensorTile ASIC(Abstract Only)., , , , , , , , , and 1 other author(s). FPGA, page 287. ACM, (2018)Heterogenous Integration Enables FPGA Based Hardware Acceleration for RF Applications., , , and . HCS, page 1-20. IEEE, (2022)On-die instrumentation to solve challenges for 28nm, 28Gbps timing variability and stressing., , , , , and . ITC, page 1-7. IEEE Computer Society, (2012)Receiver Offset Cancellation in 90-nm PLD Integrated SERDES., , , , , , and . CICC, page 265-267. IEEE, (2007)A signal integrity-based link performance simulation platform., , , , and . CICC, page 725-728. IEEE, (2005)Arria™ 10 device architecture., , , , , , , , , and 8 other author(s). CICC, page 1-8. IEEE, (2015)Introducing 28-nm stratix VFPGAs: Built for bandwidth., and . Hot Chips Symposium, page 1-23. IEEE, (2010)