From post

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

 

Другие публикации лиц с тем же именем

First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP., , , , , , , , , и 5 other автор(ы). VLSI Technology and Circuits, стр. 1-2. IEEE, (2022)Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , и 1 other автор(ы). IRPS, стр. 1-7. IEEE, (2023)Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch., , , , и . IRPS, стр. 1-6. IEEE, (2019)Metal reliability mechanisms in Ruthenium interconnects., , , , , , , , и . IRPS, стр. 1-7. IEEE, (2020)Electromigration limits of copper nano-interconnects., , , и . IRPS, стр. 1-6. IEEE, (2021)Challenges for Interconnect Reliability: From Element to System Level., , , , и . ISPD, стр. 106. ACM, (2023)The first observation of p-type electromigration failure in full ruthenium interconnects., , , , , , , и . IRPS, стр. 6. IEEE, (2018)Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps., , , , , , , , и . IRPS, стр. 1-6. IEEE, (2021)