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Study of forward AC stress degradation of GaN-on-Si Schottky diodes., , , , , , и . Microelectron. Reliab., (2018)Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration., , , , , , , , , и 8 other автор(ы). VLSI Technology and Circuits, стр. 332-333. IEEE, (2022)A novel insight of pBTI degradation in GaN-on-Si E-mode MOSc-HEMT., , , , , , , , и . IRPS, стр. 4. IEEE, (2018)BTI Arbitrary Stress Patterns Characterization & Machine-Learning optimized CET Maps Simulations., , , , , , , и . IRPS, стр. 1-5. IEEE, (2021)A Methodology to Address RF Aging of 40nm CMOS PA Cells Under 5G mmW Modulation Profiles., , , , , , , , , и 6 other автор(ы). IRPS, стр. 4. IEEE, (2024)16kbit 1T1R OxRAM arrays embedded in 28nm FDSOI technology demonstrating low BER, high endurance, and compatibility with core logic transistors., , , , , , , , , и 20 other автор(ы). IMW, стр. 1-4. IEEE, (2021)Ultra-fast CV methods (< 10µs) for interface trap spectroscopy and BTI reliability characterization using MOS capacitors., , , , , , , , и . IRPS, стр. 3. IEEE, (2022)Fast Measurement of BTI on 28nm Fully Depleted Silicon-On-Insulator MOSFETs at Cryogenic Temperature down to 4K., , , , , , , , , и . IRPS, стр. 7. IEEE, (2022)A new method for quickly evaluating reversible and permanent components of the BTI degradation., , , , , , , и . IRPS, стр. 6-1. IEEE, (2018)Performance & reliability of 3D architectures (πfet, Finfet, Ωfet)., , , , , , , , , и . IRPS, стр. 6. IEEE, (2018)