( en | de | ru )

 

Disambiguation of "Zhuo, Cheng"

Author of the publication

copydeleteadd this publication to your clipboard
Robustness of Neuromorphic Computing with RRAM-based Crossbars and Optical Neural Networks.

, , , , , , , , , and . ASP-DAC, page 853-858. ACM, (2021)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Xinping Zhuo

Zhuo Tang

Zhuo Li

Zhuo Wang

Zhuo Li

 

Other publications of authors with the same name

Boosting Uppaal for OSEK/VDX Applications with a Sequentialization Approach., , , and . SOFL+MSVL, volume 10795 of Lecture Notes in Computer Science, page 51-68. Springer, (2017)Run-time demand estimation and modulation of on-chip decaps at system level for leakage power reduction in multicore chips., , and . Integr., (2019)A zonotoped macromodeling for reachability verification of eye-diagram in high-speed I/O links with jitter., , , and . ICCAD, page 696-701. IEEE, (2014)Early-Stage Power Grid Design: Extraction, Modeling and Optimization., , and . DAC, page 79:1-79:6. ACM, (2014)Local-to-global spatial learning for whole-slide image representation and classification., , , , , , and . Comput. Medical Imaging Graph., (2023)A Fast Method to Estimate Through-Bump Current for Power Delivery Verification., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (5): 1643-1647 (May 2023)Design of Ultracompact Content Addressable Memory Exploiting 1T-1MTJ Cell., , , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (5): 1450-1462 (May 2023)An Ultracompact Single-Ferroelectric Field-Effect Transistor Binary and Multibit Associative Search Engine., , , , , , , , , and 7 other author(s). Adv. Intell. Syst., (July 2023)Worst-case Power Integrity Prediction Using Convolutional Neural Network., , , , , , , , and . ACM Trans. Design Autom. Electr. Syst., 28 (4): 54:1-54:19 (July 2023)Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs., , and . ACM J. Emerg. Technol. Comput. Syst., 11 (2): 16:1-16:14 (2014)