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SE2: Going Remote: Challenges and Opportunities to Remote Learning, Work, and Collaboration., , , , , , , , и . ISSCC, стр. 539-540. IEEE, (2021)21.3 A 6.45μW self-powered IoT SoC with integrated energy-harvesting power management and ULP asymmetric radios., , , , , , , , , и 4 other автор(ы). ISSCC, стр. 1-3. IEEE, (2015)A 0.11 PJ/OP, 0.32-128 Tops, Scalable Multi-Chip-Module-Based Deep Neural Network Accelerator Designed with A High-Productivity vlsi Methodology., , , , , , , , , и 7 other автор(ы). Hot Chips Symposium, стр. 1-24. IEEE, (2019)Error-energy analysis of hardware logarithmic approximation methods for low power applications., , , и . ISCAS, стр. 2361-2364. IEEE, (2015)A 6.45 μW Self-Powered SoC With Integrated Energy-Harvesting Power Management and ULP Asymmetric Radios for Portable Biomedical Systems., , , , , , , , , и 7 other автор(ы). IEEE Trans. Biomed. Circuits Syst., 9 (6): 862-874 (2015)A batteryless 19μW MICS/ISM-band energy harvesting body area sensor node SoC., , , , , , , , , и 2 other автор(ы). ISSCC, стр. 298-300. IEEE, (2012)SE4: ICs in PandemICs., , , , , , , , , и 6 other автор(ы). ISSCC, стр. 543-545. IEEE, (2021)Simba: Scaling Deep-Learning Inference with Multi-Chip-Module-Based Architecture., , , , , , , , , и 7 other автор(ы). MICRO, стр. 14-27. ACM, (2019)Accelerating Chip Design With Machine Learning., , , , , , , , , и 1 other автор(ы). IEEE Micro, 40 (6): 23-32 (2020)A 0.32-128 TOPS, Scalable Multi-Chip-Module-Based Deep Neural Network Inference Accelerator With Ground-Referenced Signaling in 16 nm., , , , , , , , , и 7 other автор(ы). IEEE J. Solid State Circuits, 55 (4): 920-932 (2020)