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What are the actual needs of visually impaired people?, , and . Displays, (July 2023)Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators., , , , , , and . ISQED, page 60-66. IEEE, (2021)Hetero-3D: Maximizing Performance and Power Delivery Benefits of Heterogeneous 3D ICs., , , and . ISLPED, page 1-6. ACM, (2024)Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits., , , , , , , and . DAC, page 1-6. IEEE, (2023)Buffer-based End-to-end Request Event Monitoring in the Cloud., , , , , , , and . NSDI, page 829-843. USENIX Association, (2022)Heterogeneous 3D Integration for a RISC-V System With STT-MRAM., , , , , , , , and . IEEE Comput. Archit. Lett., 19 (1): 51-54 (2020)A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping., , , , and . IEEE Trans. Very Large Scale Integr. Syst., 32 (3): 401-412 (March 2024)Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies., and . ISPD, page 127-134. ACM, (2021)Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture., , , , , , , , , and 1 other author(s). ISLPED, page 1-6. IEEE, (2021)TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs., , , , and . DAC, page 1-6. IEEE, (2020)