Author of the publication

TinyVers: A 0.8-17 TOPS/W, 1.7 μW-20 mW, Tiny Versatile System-on-chip with State-Retentive eMRAM for Machine Learning Inference at the Extreme Edge.

, , , , , and . VLSI Technology and Circuits, page 20-21. IEEE, (2022)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Analyzing the Energy-Latency-Area-Accuracy Trade-off Across Contemporary Neural Networks., , and . AICAS, page 1-4. IEEE, (2021)Variable-Rate FEC Decoder VLSI Architecture for 400G Rate-Adaptive Optical Communication., , and . ICECS, page 45-48. IEEE, (2019)TinyVers: A Tiny Versatile System-on-chip with State-Retentive eMRAM for ML Inference at the Extreme Edge., , , , , and . CoRR, (2023)Efficient Execution of Temporal Convolutional Networks for Embedded Keyword Spotting., , and . IEEE Trans. Very Large Scale Integr. Syst., 29 (12): 2220-2228 (2021)Variable-Rate VLSI Architecture for 400-Gb/s Hard-Decision Product Decoder., , and . IEEE Trans. Circuits Syst. I Regul. Pap., 68 (1): 25-34 (2021)BitWave: Exploiting Column-Based Bit-Level Sparsity for Deep Learning Acceleration., , , , and . HPCA, page 732-746. IEEE, (2024)Enabling Efficient Hardware Acceleration of Hybrid Vision Transformer (ViT) Networks at the Edge., , , and . ISCAS, page 1-5. IEEE, (2024)TinyVers: A 0.8-17 TOPS/W, 1.7 μW-20 mW, Tiny Versatile System-on-chip with State-Retentive eMRAM for Machine Learning Inference at the Extreme Edge., , , , , and . VLSI Technology and Circuits, page 20-21. IEEE, (2022)PATRONoC: Parallel AXI Transport Reducing Overhead for Networks-on-Chip targeting Multi-Accelerator DNN Platforms at the Edge., , , , , , , , and . DAC, page 1-6. IEEE, (2023)DIANA: An End-to-End Energy-Efficient Digital and ANAlog Hybrid Neural Network SoC., , , , , , , , , and 6 other author(s). ISSCC, page 1-3. IEEE, (2022)