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Optimization of Overdrive Signoff in High-Performance and Low-Power ICs., , , , и . IEEE Trans. Very Large Scale Integr. Syst., 23 (8): 1552-1556 (2015)Electrical Modeling of Lithographic Imperfections., , и . VLSI Design, стр. 423-428. IEEE Computer Society, (2010)Improved signoff methodology with tightened BEOL corners., , и . ICCD, стр. 311-316. IEEE Computer Society, (2014)Revisiting inherent noise floors for interconnect prediction., , и . SLIP, стр. 10. ACM, (2020)Benchmarking of Mask Fracturing Heuristics., , , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 36 (1): 170-183 (2017)On Aging-Aware Signoff for Circuits With Adaptive Voltage Scaling., , и . IEEE Trans. Circuits Syst. I Regul. Pap., 61-I (10): 2920-2930 (2014)Improved path clustering for adaptive path-delay testing., и . ISQED, стр. 13-20. IEEE, (2012)LTCC spiral inductor modeling, synthesis, and optimization., , , и . ASP-DAC, стр. 768-771. IEEE, (2008)ILP-Based Identification of Redundant Logic Insertions for Opportunistic Yield Improvement during Early Process Learning., , и . ICCD, стр. 269-272. IEEE Computer Society, (2017)Toward quantifying the IC design value of interconnect technology improvements., , и . SLIP, стр. 1-6. IEEE Computer Society, (2013)