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Doped GeSe materials for selector applications., , , , , , , , , and 1 other author(s). ESSDERC, page 168-171. IEEE, (2017)Metal reliability mechanisms in Ruthenium interconnects., , , , , , , , and . IRPS, page 1-7. IEEE, (2020)Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND., , , , , , , , , and . IRPS, page 1-5. IEEE, (2024)Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps., , , , , , , , and . IRPS, page 1-6. IEEE, (2021)Assessment of critical Co electromigration parameters., , , , , , , , and . IRPS, page 8. IEEE, (2022)Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias., , , , , , and . 3DIC, page 1-4. IEEE, (2014)Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill., , , , , , , , , and . IRPS, page 1-6. IEEE, (2020)