( en | de | ru )

 

Disambiguation of "Cevrero, Alessandro"

Author of the publication

copydeleteadd this publication to your clipboard
Adaptive high-speed and ultra-low power optical interconnect for data center communications.

, , , , , , , and . ICTON, page 1-4. IEEE, (2017)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Alessandro Valeri

Fluorescence resonance energy transfer between multiple chromophores studied by single-molecule spectroscopy. Uni Düsseldorf, (2009)

Alessandro Zivelonghi

Alessandro Nova

Alessandro Topa

Alessandro Manfredini

 

Other publications of authors with the same name

Background calibration using noisy reference ADC for a 12 b 600 MS/s 2 × TI SAR ADC in 14nm CMOS FinFET., , , , , , , , , and 2 other author(s). ESSCIRC, page 183-186. IEEE, (2017)A 161mW 56Gb/s ADC-Based Discrete Multitone Wireline Receiver Data-Path in 14nm FinFET., , , , , , , , , and 5 other author(s). ISSCC, page 476-478. IEEE, (2019)4×40 Gb/s 2 pJ/bit Optical RX with 8ns Power-on and CDR-Lock Time in 14nm CMOS., , , , , , , , , and 6 other author(s). OFC, page 1-3. IEEE, (2018)Using 3D integration technology to realize multi-context FPGAs., , , , , , and . FPL, page 507-510. IEEE, (2009)3D configuration caching for 2D FPGAs., , , , , , and . FPGA, page 286. ACM, (2009)DDR4 transmitter with AC-boost equalization and wide-band voltage regulators for thin-oxide protection in 14-nm SOI CMOS technology., , , , , , , , , and 1 other author(s). ESSCIRC, page 115-118. IEEE, (2017)Parallel Implementation Technique of Digital Equalizer for Ultra-High-Speed Wireline Receiver., , , , , , , , , and 3 other author(s). ISCAS, page 1-5. IEEE, (2018)A 4.8pJ/b 56Gb/s ADC-Based PAM-4 Wireline Receiver Data-Path with Cyclic Prefix in 14nm FinFET., , , , , , , , , and 6 other author(s). A-SSCC, page 239-240. IEEE, (2019)Design space exploration for field programmable compressor trees., , , , , , and . CASES, page 207-216. ACM, (2008)3D serial TSV link for low-power chip-to-chip communication., , , and . ICICDT, page 1-4. IEEE, (2014)