Author of the publication

Unified Buffer: Compiling Image Processing and Machine Learning Applications to Push-Memory Accelerators.

, , , , , , , and . ACM Trans. Archit. Code Optim., 20 (2): 26:1-26:26 (June 2023)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

FASTrust: Feature analysis for third-party IP trust verification., , , , , , , and . ITC, page 1-10. IEEE, (2015)Hardware Trojan Detection in Third-Party Digital Intellectual Property Cores by Multilevel Feature Analysis., , , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (7): 1370-1383 (2018)Unified Buffer: Compiling Image Processing and Machine Learning Applications to Push-Memory Accelerators., , , , , , , and . ACM Trans. Archit. Code Optim., 20 (2): 26:1-26:26 (June 2023)Compiling Halide Programs to Push-Memory Accelerators., , , , , , , , , and 1 other author(s). CoRR, (2021)Interstellar: Using Halide's Scheduling Language to Analyze DNN Accelerators., , , , , , , , , and 2 other author(s). ASPLOS, page 369-383. ACM, (2020)ASPLOS 2020 was canceled because of COVID-19..Low-overhead implementation of logic encryption using gate replacement techniques., , , , and . ISQED, page 257-263. IEEE, (2017)Amber: Coarse-Grained Reconfigurable Array-Based SoC for Dense Linear Algebra Acceleration., , , , , , , , , and 13 other author(s). HCS, page 1-30. IEEE, (2022)Creating an Agile Hardware Design Flow., , , , , , , , , and 22 other author(s). DAC, page 1-6. IEEE, (2020)Amber: A 16-nm System-on-Chip With a Coarse- Grained Reconfigurable Array for Flexible Acceleration of Dense Linear Algebra., , , , , , , , , and 12 other author(s). IEEE J. Solid State Circuits, 59 (3): 947-959 (March 2024)Automating System Configuration., , , , , , and . FMCAD, page 102-111. IEEE, (2021)