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Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study.

, , , , , , , , , , , , , , , and . ITC, page 1-10. IEEE Computer Society, (2013)

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Tutorial T3A: Testing Low-Power Integrated Circuits: Challenges, Solutions, and Industry Practices., , and . VLSID, page 5-6. IEEE Computer Society, (2014)A Power-Aware Test Methodology for Multi-Supply Multi-Voltage Designs., , , , and . ITC, page 1-10. IEEE Computer Society, (2008)Probe point insertion for at-speed test., , and . VTS, page 223-228. IEEE Computer Society, (1992)Impact of high level functional constraints on testability., , and . VTS, page 309-312. IEEE Computer Society, (1993)A Design For Test Perspective on I/O Management., , , and . ICCD, page 46-53. IEEE Computer Society, (1996)Design for Testability Using Architectural Descriptions., , and . ITC, page 752-761. IEEE Computer Society, (1992)Advancing test compression to the physical dimension., , , , , , , , and . ITC, page 1-10. IEEE, (2017)Non-Scan Design-for-Testability Techniques for Sequential Circuits., , , and . DAC, page 236-241. ACM Press, (1993)A Novel Failure Diagnosis Approach for Low Pin Count and Low Power Compression Architectures., , , , , , and . NATW, page 43-48. IEEE, (2015)A building block BIST methodology for SOC designs: a case study., , , and . ITC, page 111-120. IEEE Computer Society, (2001)