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Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy., , , , , и . VLSI Technology and Circuits, стр. 1-2. IEEE, (2023)1.5-nm Node Surrounding Gate Transistor (SGT)-SRAM Cell with Staggered Pillar and Self-Aligned Process for Gate, Bottom Contact, and Pillar., , , , , , , , , и 1 other автор(ы). IMW, стр. 1-4. IEEE, (2021)High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology., и . 3DIC, стр. 1-4. IEEE, (2019)A CMOS bandgap reference circuit with sub-1-V operation., , , , , , и . IEEE J. Solid State Circuits, 34 (5): 670-674 (1999)A compact and low power logic design for multi-pillar vertical MOSFETs., и . ISCAS, стр. 309-312. IEEE, (2010)Three-dimensional Integration (3DI) with Bumpless Interconnects for Tera-scale Generation : High Speed, Low Power, and Ultra-small Operating Platform., и . CICC, стр. 1-6. IEEE, (2019)Dynamic Flash Memory with Fast Block Refresh., , и . NVMTS, стр. 1-5. IEEE, (2022)Reliability of Wafer-Level Ultra-Thinning down to 3 µm using 20 nm-Node DRAMs., , , , , , и . IRPS, стр. 1-6. IEEE, (2021)Dynamic Flash Memory with Dual Gate Surrounding Gate Transistor (SGT)., и . IMW, стр. 1-4. IEEE, (2021)