From post

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

 

Другие публикации лиц с тем же именем

Wireless power transfer to stacked modules for IoT sensor nodes., , , , и . ISOCC, стр. 59-60. IEEE, (2017)A fully integrated 2×1 dual-band direct-conversion transceiver with dual-mode fractional divider and noise-shaping TIA for mobile WiMAX SoC in 65nm CMOS., , , , , , , , , и 3 other автор(ы). ISSCC, стр. 456-457. IEEE, (2010)A 1.2V 0.2-to-6.3GHz Transceiver with Less Than -29.5dB EVM@-3dBm and a Choke/Coil-Less Pre-Power Amplifier., , , , , , и . ISSCC, стр. 214-215. IEEE, (2008)A 13.7μJ/prediction 88% Accuracy CIFAR-10 Single-Chip Wired-logic Processor in 16-nm FPGA using Non-Linear Neural Network., , , , , и . HCS, стр. 1-14. IEEE, (2022)A Fully Synthesized 13.7μJ/Prediction 88% Accuracy CIFAR-10 Single-Chip Data-Reusing Wired-Logic Processor Using Non-Linear Neural Network., , , , , и . ASP-DAC, стр. 182-183. ACM, (2023)A 3D-Stacked SRAM Using Inductive Coupling Technology for AI Inference Accelerator in 40-nm CMOS., , , и . ASP-DAC, стр. 97-98. ACM, (2021)A 5.2GHz RFID Chip Contactlessly Mountable on FPC at any 90-Degree Rotation and Face Orientation., , , , , и . ASP-DAC, стр. 5-6. IEEE, (2022)A conditional clocking flip-flop for low power H.264/MPEG-4 audio/visual codec LSI., , , , , , , , , и 1 other автор(ы). CICC, стр. 527-530. IEEE, (2005)A 7-nm FinFET 1.2-TB/s/mm2 3D-Stacked SRAM Module With 0.7-pJ/b Inductive Coupling Interface Using Over-SRAM Coil and Manchester-Encoded Synchronous Transceiver., , , , и . IEEE J. Solid State Circuits, 58 (7): 2075-2086 (2023)A 3D-Stacked SRAM using Inductive Coupling with Low-Voltage Transmitter and 12: 1 SerDes., , , , , , , , и . ISCAS, стр. 1-5. IEEE, (2020)