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Disambiguation of "Oprins, Herman"

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Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).

, , , , , , , , , , , , , , , and . IRPS, page 1-7. IEEE, (2023)

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Herman Lubenstein

Herman Hahlo

Herman Widjaja

Herman Kuipers

Herman Wehling

 

Other publications of authors with the same name

Thermal experimental and modeling analysis of high power 3D packages., , , , , and . ICICDT, page 1-4. IEEE, (2015)Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures., , , , , , , , , and 1 other author(s). IEEE Trans. Very Large Scale Integr. Syst., 32 (11): 2144-2148 (November 2024)Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation., , , , , , , , , and 7 other author(s). IRPS, page 1-6. IEEE, (2024)Design issues and considerations for low-cost 3D TSV IC technology., , , , , , , , , and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC., , , , , , , , and . ISVLSI, page 33-38. IEEE, (2024)Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions., , , , , , , , , and 8 other author(s). CICC, page 1-4. IEEE, (2010)Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator., , , , , and . PSC, page 1-3. IEEE, (2023)Modeling and Control of Electrowetting Induced Droplet Motion., , and . Micromachines, 3 (1): 150-167 (2012)DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow., , , , and . CICC, page 1-4. IEEE, (2011)