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FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning.

, , , and . ISPD, page 93-101. ACM, (2024)

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GNN-based Multi-bit Flip-flop Clustering and Post-clustering Design Optimization for Energy-efficient 3D ICs., , , and . ACM Trans. Design Autom. Electr. Syst., 28 (5): 76:1-76:26 (September 2023)Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits., , , , , , , and . DAC, page 1-6. IEEE, (2023)Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs., , , , and . ISPD, page 39-46. ACM, (2021)RTL-to-GDS Design Tools for Monolithic 3D ICs., , , , , , , , , and . ICCAD, page 126:1-126:8. IEEE, (2020)FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning., , , and . ISPD, page 93-101. ACM, (2024)Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (7): 2331-2335 (July 2023)A 3D Implementation of Convolutional Neural Network for Fast Inference., , , , , , , , , and . ISCAS, page 1-5. IEEE, (2023)