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Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.

K. Croes, V. Simons, S. Beyne, V. Cherman, H. Oprins, M. Stucchi, P. Absil, A. Glabman, and E. Wilcox. IRPS, page 1-4. IEEE, (2019)

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Vladimir Legradi

Vladimir Spasitsch

Vladimir Oreskovic

Vladimir Milutinovi

Vladimir Borisov

Other publications of authors with the same name

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.W. Guo, G. der Plas, A. Ivankovic, G. Eneman, V. Cherman, B. Wachter, A. Mercha, M. Gonzalez, Y. Civale, A. Redolfi and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges.J. Vos, V. Cherman, M. Detalle, T. Wang, A. Salahouelhadj, R. Daily, G. der Plas, and E. Beyne. 3DIC, page 1-7. IEEE, (2014)Stress mitigation of 3D-stacking/packaging induced stresses.K. Croes, V. Cherman, M. Lofrano, H. Zahedmanesh, L. Kljucar, M. Gonzalez, I. Wolf, Z. Tökei, and E. Beyne. IRPS, page 4. IEEE, (2018)Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.K. Croes, V. Simons, S. Beyne, V. Cherman, H. Oprins, M. Stucchi, P. Absil, A. Glabman, and E. Wilcox. IRPS, page 1-4. IEEE, (2019)Fine grain thermal modeling and experimental validation of 3D-ICs.H. Oprins, A. Srinivasan, M. Cupák, V. Cherman, C. Torregiani, M. Stucchi, G. der Plas, P. Marchal, B. Vandevelde, and E. Cheng. Microelectron. J., 42 (4): 572-578 (2011)Analysis of microbump induced stress effects in 3D stacked IC technologies.A. Ivankovic, G. der Plas, V. Moroz, M. Choi, V. Cherman, A. Mercha, P. Marchal, M. Gonzalez, G. Eneman, W. Zhang and 9 other author(s). 3DIC, page 1-5. IEEE, (2011)Towards accurate temperature prediction in BEOL for reliability assessment (Invited).M. Lofrano, H. Oprins, X. Chang, B. Vermeersch, O. Pedreira, A. Lesniewska, V. Cherman, I. Ciofi, K. Croes, S. Park and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Design issues and considerations for low-cost 3D TSV IC technology.G. der Plas, P. Limaye, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti, D. Velenis and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)Thermal experimental and modeling analysis of high power 3D packages.H. Oprins, V. Cherman, G. der Plas, F. Maggioni, J. Vos, and E. Beyne. ICICDT, page 1-4. IEEE, (2015)

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Disambiguation of "Cherman, Vladimir"

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Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.

Please choose a person to relate this publication to

Vladimir Legradi

Vladimir Spasitsch

Vladimir Oreskovic

Vladimir Milutinovi

Vladimir Borisov

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Cherman, Vladimir"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.

Please choose a person to relate this publication to

Vladimir Legradi

Vladimir Spasitsch

Vladimir Oreskovic

Vladimir Milutinovi

Vladimir Borisov

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.