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Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study., , , , , , , , , и 6 other автор(ы). ITC, стр. 1-10. IEEE Computer Society, (2013)DfT architecture and ATPG for Interconnect tests of JEDEC Wide-I/O memory-on-logic die stacks., , , , , , , , , и . ITC, стр. 1-10. IEEE Computer Society, (2012)An embedded wide-range and high-resolution CLOCK jitter measurement circuit., , , и . DATE, стр. 1637-1640. IEEE Computer Society, (2010)A Multilayer Data Copy Scheme for Low Cost Test with Controlled Scan-In Power for Multiple Scan Chain Designs., , , , , и . ITC, стр. 1-8. IEEE Computer Society, (2006)A 2-ps Resolution Wide Range BIST Circuit for Jitter Measurement., , и . ATS, стр. 219-223. IEEE, (2007)Black-box leakage power modeling for cell library and SRAM compiler., , , , и . DATE, стр. 637-642. IEEE, (2011)A built-in self-test scheme for the post-bond test of TSVs in 3D ICs., , , , , и . VTS, стр. 20-25. IEEE Computer Society, (2011)Diagnosis for MRAM write disturbance fault., , , , , , и . ITC, стр. 1-9. IEEE Computer Society, (2007)A Test Integration Methodology for 3D Integrated Circuits., , , , , и . Asian Test Symposium, стр. 377-382. IEEE Computer Society, (2010)Experimental Results of Built-In Jitter Measurement for Gigahertz Clock., , и . ATS, стр. 268. IEEE Computer Society, (2008)