( en | de | ru )

 

Disambiguation of "Blanck, Hervé"

Author of the publication

copydeleteadd this publication to your clipboard
GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse.

, , , , , , , , , , , and . IRPS, page 11. IEEE, (2022)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Lucien Hervé

Luis Pablo Hervé Claude

Momo Jeufack Hervé

Yves Hervé

Hervé Chang

 

Other publications of authors with the same name

On-wafer RF stress and trapping kinetics of Fe-doped AlGaN/GaN HEMTs., , , , , , , , , and 7 other author(s). Microelectron. Reliab., (2018)High resolution physical analysis of ohmic contact formation at GaN-HEMT devices., , , , , , , , , and . Microelectron. Reliab., (2017)Reliability of high voltage/high power L/S-band Hbt technology., , , , , , , , , and . Microelectron. Reliab., 50 (9-11): 1543-1547 (2010)GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse., , , , , , , , , and 2 other author(s). IRPS, page 11. IEEE, (2022)Failure signatures on 0.25 μm GaN HEMTs for high-power RF applications., , , , , , , , and . Microelectron. Reliab., 54 (9-10): 2237-2241 (2014)GaAs Industry in Europe - Technologies, Trends and New Developments., , , and . IEICE Trans. Electron., 91-C (7): 1076-1083 (2008)Improved thermal management for GaN power electronics: Silver diamond composite packages., , , , , , , , , and . Microelectron. Reliab., 52 (12): 3022-3025 (2012)Deep level effects and degradation of 0.15 μm RF AlGaN/GaN HEMTs with Mono-layer and Bi-layer AlGaN backbarrier., , , , , , , , , and 8 other author(s). IRPS, page 51-1. IEEE, (2022)